PEALD&PECVD

PEALD&PECVD Combined System

ALD Chamber：

1 SUS316 stainless deposition chamber, dual heater design for substrate;

2 Lid integrated with plasma enhanced modular;

3 high speed ALD diaphragm valves;

4 Up to 12 inch;

5 Substrate heating up to 400℃;

6 Up to 6 precursors and 6 gas lines;

7 Metal sealed pipes, heatable up to 120℃;

8 Heating and Cooling for precursor tanks;

9 Fully automatic process control, manually compatible.

PECVD Chamber：