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Atomic layer deposition

  • Plasma Enhanced Atomic Layer Deposition System
  • Plasma Enhanced Atomic Layer Deposition System
  • Plasma Enhanced Atomic Layer Deposition System
  • Plasma Enhanced Atomic Layer Deposition System
  • Plasma Enhanced Atomic Layer Deposition System
Plasma Enhanced Atomic Layer Deposition SystemPlasma Enhanced Atomic Layer Deposition SystemPlasma Enhanced Atomic Layer Deposition SystemPlasma Enhanced Atomic Layer Deposition SystemPlasma Enhanced Atomic Layer Deposition System

Plasma Enhanced Atomic Layer Deposition System

  • Fully Automatic Operation
  • PE and Thermal mode compatible
  • User-Friendly Operation System
  • Cost-Effective ALD System
  • Product description: Plasma Enhanced Atomic Layer Deposition, PEALD Atomic Layer Deposition ALD Thermal Atomic Layer Deposition
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Plasma Enhanced Atomic Layer Deposition System, PEALD


Features:

1 SUS316 stainless deposition chamber, dual heater design for substrate;

2 Lid integrated with plasma enhanced modular;

3 high speed ALD diaphragm valves;

4 Up to 12 inch;

5 Substrate heating up to 400℃;

6 Up to 6 precursors and 6 gas lines;

7 Metal sealed pipes, heatable up to 120℃;

8 Heating and Cooling for precursor tanks;

9 Fully automatic process control, manually compatible.