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Atomic layer deposition

Plasma Enhanced Atomic Layer Deposition System

  • Fully Automatic Operation
  • PE and Thermal mode compatible
  • User-Friendly Operation System
  • Cost-Effective ALD System
  • Product description: Plasma Enhanced Atomic Layer Deposition, PEALD Atomic Layer Deposition ALD Thermal Atomic Layer Deposition
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Plasma Enhanced Atomic Layer Deposition System, PEALD


Features:

1 SUS316 stainless deposition chamber, dual heater design for substrate;

2 Lid integrated with plasma enhanced modular;

3 high speed ALD diaphragm valves;

4 Up to 12 inch;

5 Substrate heating up to 400℃;

6 Up to 6 precursors and 6 gas lines;

7 Metal sealed pipes, heatable up to 120℃;

8 Heating and Cooling for precursor tanks;

9 Fully automatic process control, manually compatible.