The MA/BA Gen4 series represents the latest generation of SUSS MicroTec’s semi-automated mask and bond aligner and introduces a new platform system. The two platform types differ in configuration, and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series dedicated to advanced and high-end processes.
The MA/BA Gen4 series is the entry-level model, available as MA/BA6 Gen4 and MA/BA8 Gen4. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and low-volume production.
SUSS MicroTec’s MA/BA Gen4 series is setting a new benchmark in full-field lithography for academia, MEMS & NEMS, 3D integration and compound semiconductor markets. It is also prepared to handle processes like bond alignment, fusion bonding and SMILE imprinting.
Processes developed on the MA/BA Gen4 series can be quickly transferred onto SUSS MicroTec‘s automated mask alignment platforms for high-volume production.
Contact: Ms. He
Phone: 18316226492
Tel: 0755-28485351
Email: info@hightrendtech.com
Add: Room 352, 3rd Floor, 3010 Banxuegang Avenue Bantial Street, Longgang District, Shenzhen Guangdong 518219, China